Introducing CS-4 — the fastest AI accelerator in the industry. See the numbers →

Cerebras CS-4 · Wafer-Scale System · Nexus Platform

The Fastest AI Just Got Faster.

The all-new Cerebras CS-4 is a revolutionary rack-scale solution built from three WSE-3 Turbo wafer-scale engines — delivering up to 30× faster inference than GPU systems, enhanced economics, and a simple path to deploy hyperscale capacity. It is the architecture for frontier AI.1

Two Cerebras CS-4 racks — front view with hexagonal door pattern and Cerebras logo, and side view exposing power and liquid-cooling plumbing
30×faster inference than GPU systems1
750PFLOPS of AI compute per system1
129.6PB/s memory bandwidth1
2µswafer-to-wafer latency1
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01 — The machine

A rack re-imagined around
the largest chip ever built

CS-4 is the first system built on the Cerebras Nexus rack-scale platform. Each system packs three WSE-3 Turbo processors into pluggable Wafer-Scale Backpacks, with all-new power, cooling, and I/O engineered around the wafer — not bolted onto it.2

Every wafer delivers up to 2× the speed of the previous generation, and the system delivers up to 10× more throughput per watt than CS-3 — while generating tokens up to 30× faster than production GPU systems. The result: a machine designed to deliver both throughput and interactivity.2

  • Three WSE-3 Turbo engines per rack-scale system
  • Up to 2× the speed of the previous generation, per wafer
  • All-new power, cooling, and I/O — more performance per wafer
  • Nexus rack-scale platform for rapid hyperscale deployment
The Cerebras CS-4 rack — a black cabinet with the Cerebras logo, three Wafer-Scale Backpacks mounted on one side and the power and I/O spine on the other
The Cerebras CS-4. Three pluggable Wafer-Scale Backpacks dock into the Nexus power array. Image: Cerebras
The Cerebras CS-4 in dark studio light — a tall black rack with three Wafer-Scale Backpacks and cooling connections
CS-4 studio profile. Image: Cerebras

02 — The wafer at its heart

WSE-3 Turbo: four trillion transistors,
one extraordinary wafer

Three golden WSE-3 wafer-scale processors, each a full 300mm silicon wafer patterned with dies
Wafer-Scale Engines — each the size of a dinner plate, each a single processor. Image: Cerebras

At the center of CS-4 is the newly announced WSE-3 Turbo — like the WSE-3, the largest AI processor ever built. One wafer integrates 4 trillion transistors and 900,000 AI-optimized cores across 46,225 mm² of silicon, with 44 GB of SRAM directly on the wafer.1

The Turbo doubles what matters: AI compute to 250 PFLOPS per wafer, memory bandwidth to 43.2 PB/s, on-chip fabric bandwidth to 53.5 PB/s, and off-chip I/O to 2.4 Tb/s. Because memory bandwidth determines decode speed and throughput, this is a step-change in both.1

Why wafer scale? A single wafer holds the model weights and the entire interconnect on-chip, so inference never bottlenecks on GPU-to-GPU links. Compared with NVIDIA's flagship B200, one WSE-3 carries 19× more transistors and delivers 28× more AI compute — and it does the work that would otherwise require racks of GPUs.4

4 Ttransistors on one wafer
900,000AI-optimized cores
46,225 mm²of silicon — the largest chip ever built
44 GBof SRAM on-wafer
250PFLOPS AI compute per wafer
43.2PB/s memory bandwidth per wafer

One wafer. Not racks of GPUs.

Wafer-scale integration replaces the interconnect fabric of an entire GPU cluster with on-chip wires. Squares below are drawn with areas in proportion to transistor count — 4 trillion on one WSE-3 versus 208 billion on an NVIDIA B200.4

19× more transistors · 28× more AI compute per device. Illustration; areas proportional to transistor count.

03 — Architecture

Nexus: compute, power, and I/O
engineered as one system

The next leap in AI infrastructure cannot come from improving one component in isolation. Nexus rethinks the rack around three modular elements — each self-contained, each field-upgradeable, and together cutting deployment time from days to hours.3

Exploded view of a Cerebras Wafer-Scale Backpack: cold plate, wafer, I/O boards, and power module sub-assembly

Wafer-Scale Backpack

Explore the backpack

Each Wafer-Scale Backpack folds the wafer, power conversion, direct liquid cooling, high-speed I/O, and control electronics into one compact, self-contained 3D package — with 50% fewer components than the prior generation. Hover or tap a marker to inspect each subsystem.

  • Self-contained, rear-mounted, vertically attached to the power array
  • Deployment reduced from days to hours
  • 60% more automated manufacturing
Cerebras's labeled exploded diagram of the Wafer-Scale Backpack: cold plate, wafer, two I/O boards, and the power module sub-assembly
Cerebras's own labeled view of the same assembly — cold plate, wafer, I/O boards, and power module sub-assembly. Image: Cerebras
CS-4 Nexus rack with three Wafer-Scale Backpacks docked and the integrated power module highlighted

Compute

Pluggable Wafer-Scale Backpacks

Cerebras fundamentally re-imagined the server. Each backpack is a self-contained assembly built directly around the wafer, decoupled from power supplies — simplifying manufacturing and letting compute slide into a pre-qualified rack in hours, not days.3

  • 50% fewer components than CS-3's design
  • 60% more automated manufacturing
  • Field-upgradeable without rack redesign

Power

High-density power delivery

Power conversion sits just 0.5 mm from the processor — roughly 100× closer than the ~50 mm of conventional GPU boards — nearly eliminating board-level power loss. Twice as much power reaches the WSE-3T, enabling higher frequencies and faster tokens.2

  • 100× closer power conversion
  • 2× the power delivered to the wafer
  • Direct liquid cooling in every backpack
Exploded view of the CS-4 Wafer I/O Module extending the fabric from the edges of the wafer

I/O

A programmable wafer I/O fabric

A new I/O subsystem doubles bandwidth and slashes latency. Standards-based RoCE v2 RDMA over Ethernet plugs into existing infrastructure, while Direct Wafer Links connect wafers within and across racks with no switch — wafer-to-wafer latency as low as two microseconds.1

  • 2.4 Tb/s off-wafer I/O per wafer; 7.2 Tb/s per rack
  • Switch-free Direct Wafer Links across racks
  • 2µs wafer-to-wafer latency — down from 5µs

04 — Performance

A new high-water mark
for inference speed

In head-to-head serving on GPT-OSS-120B with identical prompts, CS-4 delivers more than 4,400 tokens per second per user — up to 30× faster than GPU solutions. And the advantage holds from small efficient models to the largest models in the world.1

Tokens per second per user — CS-4 vs. GPU systems

Values approximate, read from Cerebras's published chart. Source: Artificial Analysis and internal benchmarking, August 2026.5 Actual throughput varies by model architecture, context length, precision, and serving configuration.

2 µs

Wafer-to-wafer latency

Direct Wafer Links cut interconnect latency from 5µs to as low as 2µs. Serving a model across wafers no longer costs interactivity — CS-4 sustains more than 1,000 tokens per second on models exceeding 10 trillion parameters, and scales to models beyond 50 trillion parameters across clusters.1

10×

More throughput per watt

CS-4 shifts the inference Pareto frontier: up to 10× more throughput per watt than CS-3 while generating tokens up to 30× faster than GPU systems. Fast tokens are worth more than slow tokens — operators get more capacity and more value per token within the same power budget.2

>1,000

Tokens/sec at 10T+ parameters

Agentic and reasoning workloads live or die on decode speed. At over 1,000 tokens per second per user on 10-trillion-parameter models, a CS-4 cluster keeps frontier-class models fully interactive.2

Cerebras chart: wafer-to-wafer latency versus model size. GPU latency rises steeply to about 0.6 ms at 10 trillion parameters while CS-4 stays near 0.2 ms — 2.5 times lower latency
Wafer-to-wafer latency versus model size: CS-4 enables sub-1ms latency (1,000 tok/s) for 10T-parameter models and beyond. Chart: Cerebras — extrapolation from internal benchmarking, Aug 2026
Cerebras chart: throughput versus interactivity. GPU systems sit at slow interactivity; CS-3 reaches ultrafast; CS-4 extends the frontier with up to 2x faster speed and up to 10x more token capacity
Throughput versus interactivity: CS-4 expands the ultrafast inference frontier — up to 10× more token capacity and up to 2× faster than CS-3. Chart: Cerebras — internal benchmarking and projections, Aug 2026

05 — Hyperscale

Built for gigawatt-scale
AI factories

CS-4 separates the stable power, cooling, and network layer from its modular compute. The PowerRack can be installed and facility-qualified before compute arrives; backpacks then slide into place and connect — turning hyperscale deployment from a construction project into a logistics step.2

7.2Tb/s system I/O per rack1
160.5PB/s compute fabric bandwidth1
>50 Tparameter models supported across clusters1

06 — Workloads

Fast tokens change what
products can do

"Being 30 times faster doesn't just make a response feel fast. It gives an agentic system room for more than an order of magnitude as much reasoning, verification, or tool use in the same wall-clock time." — Sean Lie, CTO & co-founder, Cerebras1

Agentic AI & reasoning

Agents chain dozens of model calls per task. At thousands of tokens per second, multi-step reasoning, self-verification, and tool use complete in the time a GPU system spends on a single reply — making genuinely interactive agents practical.

Disaggregated inference

CS-4 natively supports disaggregated serving: a purpose-built prefill engine — including AMD Helios or AWS Trainium — processes the prompt, then hands state to CS-4 for ultra-low-latency decode. GPU or ASIC for prefill, wafer scale for speed.3

Frontier-scale models

With 2µs Direct Wafer Links, massive CS-4 clusters serve models beyond 50 trillion parameters at interactive speeds — capacity for the next generation of frontier models without waiting for new silicon.1

Training & research

Wafer-scale systems have long served both training and inference with single-device simplicity — chosen by leading corporations, research institutes, and governments. Cerebras counts organizations such as OpenAI, AWS, G42, and MBZUAI among its customers and partners.14

"In AI, speed is productivity. Historically, fast inference meant using smaller and less capable models. Cerebras CS-4 delivers industry-leading speeds on the largest frontier models, fundamentally changing the paradigm."

Andrew Feldman — CEO & co-founder, Cerebras1

"CS-4 makes dramatic improvements in system deployability, reliability, and networking, which enables scaling performance to larger models for large scale token factories."

Dylan Patel — Founder & CEO, SemiAnalysis1

07 — By the numbers

CS-3 vs. CS-4

MetricCS-3 (one wafer)CS-4 (three wafers)
AI compute125 PFLOPS750 PFLOPS
Memory bandwidth21.6 PB/s129.6 PB/s
On-chip fabric bandwidth26.7 PB/s160.5 PB/s
System I/O bandwidth1.2 Tbit/s7.2 Tbit/s
I/O latency5 µs2 µs

Source: Cerebras CS-4 announcement, August 18, 2026.1

First CS-4 shipments begin this quarter.1

08 — FAQ

Questions, answered

What is Cerebras CS-4?

CS-4 is Cerebras's fourth-generation AI system: a rack-scale solution built from three WSE-3 Turbo wafer-scale processors, delivering 750 PFLOPS of AI compute, 129.6 PB/s of memory bandwidth, and 7.2 Tb/s of I/O. It is the first system on the Nexus rack-scale platform architecture, announced August 18, 2026.1

How is CS-4 different from CS-3?

CS-4 is up to 2× faster per wafer and delivers up to 10× more throughput per watt than CS-3. The WSE-3 Turbo doubles AI compute (250 vs. 125 PFLOPS per wafer), memory bandwidth (43.2 vs. 21.6 PB/s), on-chip fabric bandwidth (53.5 vs. 26.7 PB/s), and I/O (2.4 vs. 1.2 Tb/s), while wafer-to-wafer latency drops from 5µs to 2µs. The rack itself is new: modular Nexus compute, power, and I/O instead of a monolithic design.1

How fast is CS-4?

In a head-to-head comparison on GPT-OSS-120B with identical prompts, CS-4 delivers more than 4,400 tokens per second per user — up to 30× faster than GPU solutions — and sustains over 1,000 tokens per second on models exceeding 10 trillion parameters.1

How much throughput does CS-4 provide?

CS-4 delivers up to 10× more throughput per watt than CS-3 while generating tokens up to 30× faster than production GPU systems — shifting the Pareto frontier so operators no longer choose between interactivity and total capacity.2

Why is CS-4 well suited for agentic AI?

Agentic workloads chain many model calls — reasoning, verification, tool use — for every user request. At up to 30× GPU speed, CS-4 gives agents more than an order of magnitude more compute inside the same wall-clock budget, turning batch-feeling agents into interactive ones.1

What is a Wafer-Scale Backpack?

The backpack is CS-4's compute module: a rear-mounted, self-contained assembly that folds the wafer, power conversion, direct liquid cooling, high-speed I/O, and control electronics into one compact 3D package. It has 50% fewer components than the prior design and attaches vertically to the power array, so compute can be installed, serviced, or upgraded independently.3

How does the Nexus Platform Architecture simplify hyperscale deployment?

Nexus separates the stable infrastructure layer — power, cooling, network — from modular compute. The PowerRack is installed and facility-qualified first; compute backpacks slide in later and connect to power, cooling, and data. Deployment drops from days to hours, and future upgrades no longer require redesigning the whole system.2

What models and inference architectures does CS-4 support?

CS-4 serves today's frontier open and proprietary models — Cerebras's published results span Llama 3.3 70B, GPT-OSS-120B, GLM 4.7, and Kimi K2.7-class trillion-parameter models — and clusters support models beyond 50 trillion parameters. It natively supports disaggregated inference, pairing GPU or ASIC prefill (including AMD Helios and AWS Trainium) with Cerebras decode.35

Bring the fastest AI
to your data center.

First CS-4 shipments begin this quarter. Talk to Cerebras about hyperscale capacity, cloud access, or a proof of concept on your own models.

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